Maximizing Thermal Cooling Efficiencies in High-Performance Processors

Despite the continuous development of new, higher performing processors, the thirst for increased embedded computing capability remains unquenched. In fact, it seems like Moore’s Law may have slowed when it comes to frequency but increased in terms of driving processor core and field programmable gate array (FPGA) LUTS counts. The previous need for fewer frequency increases has become a need for increased core counts, faster front side bus speeds, and greater support chip integration, all of which drive continually rising power requirements. Meeting these ever increasing "compute density escalations" while simultaneously maximizing thermal cooling efficiencies requires innovative packaging solutions.