Laser Integration on Silicon Photonic Circuits Through Transfer Printing

The purpose of this project was to develop a transfer printing process for the massively parallel integration of III-V lasers on silicon photonic integrated circuits. Silicon has long offered promise as the ultimate platform for realizing compact photonic integrated circuits (PICs). That promise stems in part from the material's properties: the high refractive-index contrast of silicon allows strong confinement of the optical field, increasing light-matter interaction in a compact space—a particularly important attribute for realizing efficient modulators and high-speed detectors.