Laser Direct Structuring and Liquid Crystal Polymer Simplify Circuit Miniaturization

There has long been a desire to deposit conductive paths directly on molded plastic structures, combining the electrical and mechanical functions in one component to form an injection-molded circuit carrier. This technology has been accomplished by using the Laser Direct Structuring (LDS) process from LPKF on modified Vectra® LCP (Liquid Crystal Polymer) material from Ticona. The electronics housing can substitute for the conventional circuit board, encouraging miniaturization. This technology is suitable for mobile communication devices, hearing aids, and sensory technology for automobile electronics just to name a few.