KEEPING YOUR SILICON COOL
22AUTP10_03
10/01/2022
- Content
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A Parker Chomerics expert shares real-world solutions for the heat-dissipation challenges in onboard electronics.
Onboard electronics continue to evolve rapidly. Components are smaller. Systems are more complex. The sophisticated electronics components that make up modern vehicles require precision heat dissipation for reliable operation. To help components and systems designers deliver high-performance, cost-effective solutions, the following are several actual cases illustrating the types of thermal interface material (TIM) and their performance properties,
- Pages
- 4
- Citation
- Casper, S., "KEEPING YOUR SILICON COOL," Mobility Engineering, October 1, 2022.