KEEPING YOUR SILICON COOL

22AUTP10_03

10/01/2022

Authors Abstract
Content

A Parker Chomerics expert shares real-world solutions for the heat-dissipation challenges in onboard electronics.

Onboard electronics continue to evolve rapidly. Components are smaller. Systems are more complex. The sophisticated electronics components that make up modern vehicles require precision heat dissipation for reliable operation. To help components and systems designers deliver high-performance, cost-effective solutions, the following are several actual cases illustrating the types of thermal interface material (TIM) and their performance properties,

Meta TagsDetails
Pages
4
Citation
Casper, S., "KEEPING YOUR SILICON COOL," Mobility Engineering, October 1, 2022.
Additional Details
Publisher
Published
Oct 1, 2022
Product Code
22AUTP10_03
Content Type
Magazine Article
Language
English