Joining of Ti, Mo, and Ni Terminated Thermoelectric Segments via Brazing

The joining of low- and high-temperature thermoelectric materials (with ZT optimized to specific temperature ranges) to each other in a segmented configuration can lead to enhanced device efficiency. The resulting joints between these materials must be both chemically and thermally stable over the operating lifetime of the device (~17 years). In addition, using joining methods and/or materials that can reduce the temperature and time at temperature for the bonding cycle can be beneficial in minimizing thermomechanical stresses associated with device fabrication.