Integrated Three-Dimensional Module Heat Exchanger for Power Electronics Cooling

Critical elements in the operation of electric drive systems are power electronics and power semiconductor packages. Improving thermal management of power electronics can help reduce the cost, weight, and volume of electric drive systems, and thus increase market acceptance. The power semiconductor packaging must provide the necessary electrical connections, while at the same time enabling heat removal from the semiconductor devices such as insulated gate bipolar transistors (IGBTs) and diodes.