InGaAs SWIR Imagers Optimize Semiconductor Inspection

As the volume of consumer electronics increases, semiconductor fabrication plants are manufacturing larger and larger wafers to handle the demand (e.g., 300 mm substrates). The escalating value of these larger wafers is driving the industry to employ more advanced imaging technologies for quality control. Inspecting the raw material substrate for flaws before processing and detecting defects during processing is critical to keeping costs down. New and improved inspection techniques save the semiconductor manufacturing industry hundreds of millions of dollars each year.