Infrared Technology for Chamber Clean Endpoint Detection

Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) processes deposit material on all surfaces in a process chamber. Over time, the thickness of these deposits increases to the point that material begins to delaminate, producing gas-phase particulates that negatively impact process yield. Remote and in situ chemical etching processes are used to periodically remove these deposits from chamber walls, maintaining chamber cleanliness.