Implementing Thermal Bumps in New Product Designs

Thermal issues are dominating today’s electronic product design landscape as never before. It is easy to see this in Intel’s move to a multi-core architecture as a methodology to manage their thermal problems. Of course, less than optimal solutions lead to less than optimal results. Thermoelectric devices (TECs) have been used in the optoelectronics industry for thermal management, but have not found wide-spread acceptance in electronic product design. Thermal management solutions implemented with these active devices, however, offer a broad potential for implementation including the following: