High-Temperature, Distributed Control Using Custom CMOS ASICs

Four application specific integrated circuits (ASICs) that provide sensing, actuation, and power conversion capabilities for distributed control in a high-temperature (over 200 °C) environment were developed. The four ASICs are combined with a digital signal processor (DSP) to create a distributed control node. Patented circuit design techniques facilitate fabrication in a conventional 0.5-micron bulk complimentary metal oxide semiconductor (CMOS) foundry process.