Heterogeneous Integration and SiPs Benefit SWaP-C Reduction

Aerospace and defense (A&D) electronic systems are being made smaller but more functional. This is possible because of industry-wide efforts to reduce the size, weight, and power as well as cost (SWaP-C) of electronic components, especially though heterogeneous integration such as by combining analog, digital, and mixed-signal circuits, and components. Intelligent integration can provide A&D systems and subsystems in the forms of system-in-package (SiP) and system-on-chip (SoC) devices that help meet challenging SWaP-C goals without compromising functionality and/or performance. While SiP devices may not provide all SWaP-C solutions, they can help add A&D electronic functionality to a growing number of applications designed to fit smaller sizes, such as portable mission-critical communications and unmanned aerial system (UAS) applications.