Magazine Article

Hermetic Wafer Bonding by Use of Microwave Heating

TBMG-7340

05/01/2001

Abstract
Content

Microwave heating is the basis of a simple technique for quickly and gently bonding two metallized dielectric or semiconductor wafers to each other. The technique can be used, for example, to bond a flat, gold-coated silicon wafer to another gold-coated silicon wafer that is flat except for a cavity, in order to hermetically seal the cavity (see figure). The technique has the potential to become a standard one for bonding in the fabrication of microelectromechanical systems (MEMS).

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Citation
"Hermetic Wafer Bonding by Use of Microwave Heating," Mobility Engineering, May 1, 2001.
Additional Details
Publisher
Published
May 1, 2001
Product Code
TBMG-7340
Content Type
Magazine Article
Language
English