Glue Activated by Magnetic Field

TBMG-38664

03/01/2021

Abstract
Content

Conventional adhesives like epoxy that are used to bond plastic, ceramics, and wood are typically designed to cure using moisture, heat, or light. They often require specific curing temperatures, ranging from room temperature up to 80 °C. The curing process is necessary to cross-link and bond the glue with the two secured surfaces as the glue crystallizes and hardens to achieve its final strength.

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Citation
"Glue Activated by Magnetic Field," Mobility Engineering, March 1, 2021.
Additional Details
Publisher
Published
Mar 1, 2021
Product Code
TBMG-38664
Content Type
Magazine Article
Language
English