Front-Side Microstrip Line Feeding a Raised Antenna Patch
TBMG-212
9/1/2005
- Content
An improved design concept for a printed-circuit patch antenna and the transmission line that feeds the patch calls for (1) a microstrip transmission line on the front (radiative) side of a printed-circuit board based on a thin, high-permittivity dielectric substrate; (2) using the conductor covering the back side of the circuit board as a common ground plane for both the microstrip line and the antenna patch; (3) supporting the antenna patch in front of the circuit board on a much thicker, lower-permittivity dielectric spacer layer; and (4) connecting the microstrip transmission line to the patch by use of a thin wire or narrow ribbon that extends through the thickness of the spacer and is oriented perpendicularly to the circuit-board plane. The thickness of the substrate is typically chosen so that a microstrip transmission line of practical width has an impedance between 50 and 100 . The advantages of this design concept are best understood in the context of the disadvantages of prior design concepts, as explained below.
- Citation
- "Front-Side Microstrip Line Feeding a Raised Antenna Patch," Mobility Engineering, September 1, 2005.