Flight Hardware Packaging Design for Stringent EMC Radiated Emission Requirements
TBMG-16332
05/01/2013
- Content
This packaging design approach can help heritage hardware meet a flight project’s stringent EMC radiated emissions requirement. The approach re quires only minor modifications to a hardware’s chassis and mainly concentrates on its connector interfaces. The solution is to raise the surface area where the connector is mounted by a few millimeters using a pedestal, and then wrapping with conductive tape from the cable backshell down to the surface-mounted connector. This design approach has been applied to JPL flight project subsystems.
- Citation
- "Flight Hardware Packaging Design for Stringent EMC Radiated Emission Requirements," Mobility Engineering, May 1, 2013.