Magazine Article

Flight Hardware Packaging Design for Stringent EMC Radiated Emission Requirements

TBMG-16332

05/01/2013

Abstract
Content

This packaging design approach can help heritage hardware meet a flight project’s stringent EMC radiated emissions requirement. The approach re quires only minor modifications to a hardware’s chassis and mainly concentrates on its connector interfaces. The solution is to raise the surface area where the connector is mounted by a few millimeters using a pedestal, and then wrapping with conductive tape from the cable backshell down to the surface-mounted connector. This design approach has been applied to JPL flight project subsystems.

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Citation
"Flight Hardware Packaging Design for Stringent EMC Radiated Emission Requirements," Mobility Engineering, May 1, 2013.
Additional Details
Publisher
Published
May 1, 2013
Product Code
TBMG-16332
Content Type
Magazine Article
Language
English