Engineers Build Reconfigurable Artificial Intelligence Chip

MIT engineers are taking a modular approach with a LEGO-like design for a stackable, reconfigurable artificial intelligence chip. The design comprises alternating layers of sensing and processing elements, along with light-emitting diodes (LED) that allow for the chip’s layers to communicate optically. Other modular chip designs employ conventional wiring to relay signals between layers. Such intricate connections are difficult if not impossible to sever and rewire, making such stackable designs not reconfigurable.