Embedded Intelligence and Connectivity: High-Performance Modules for Mixed-Critical Applications

TBMG-47281

01/01/2023

Abstract
Content

The growing use of artificial intelligence (AI) in medical applications is leading to drastically higher performance demands for the embedded computing technology. Besides processing ever-increasing amounts of data — ideally in real time — medical devices must also handle local AI inference, record data from imaging procedures, and use data and cyber secure gateway functions to transmit these, for instance to PACS or the electronic patient record. At the same time, medical OEMs want to integrate their applications on a single hardware platform. To do so for a point of care environment, also requires functional safety. The new high-end COM-HPC computer-on-module standard provides the required technology basis for the development of the next generation of intelligent medical computers with integrated functional safety to manage critical medical device functions in the future.

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Citation
"Embedded Intelligence and Connectivity: High-Performance Modules for Mixed-Critical Applications," Mobility Engineering, January 1, 2023.
Additional Details
Publisher
Published
Jan 1, 2023
Product Code
TBMG-47281
Content Type
Magazine Article
Language
English