Magazine Article

Electronic Modules With a 3-D Interconnection Scheme

TBMG-6738

02/01/2000

Abstract
Content

An improved three-dimensional (3-D) scheme for modular packaging and interconnection of electronic circuits has been proposed to overcome deficiencies of an older scheme and to obtain additional advantages. In particular:

Meta TagsDetails
Citation
"Electronic Modules With a 3-D Interconnection Scheme," Mobility Engineering, February 1, 2000.
Additional Details
Publisher
Published
Feb 1, 2000
Product Code
TBMG-6738
Content Type
Magazine Article
Language
English