Electronic Modules With a 3-D Interconnection Scheme
TBMG-6738
02/01/2000
- Content
An improved three-dimensional (3-D) scheme for modular packaging and interconnection of electronic circuits has been proposed to overcome deficiencies of an older scheme and to obtain additional advantages. In particular:
- Citation
- "Electronic Modules With a 3-D Interconnection Scheme," Mobility Engineering, February 1, 2000.