Electromechanical Testing of Microelectromechanical Devices

A method of electromechanical testing has been proposed for general diagnosis, evaluation of performance, and burn-in (accelerated life testing) of microelectromechanical devices. The tests would ordinarily be performed at the wafer level; that is, after the devices have been fabricated on wafers but before the wafers have been diced and the dies packaged. Alternatively or in addition, the tests could be performed at other stages of the fabrication process.