Magazine Article

Deepak Condenser Model (DeCoM)

TBMG-16852

07/01/2013

Abstract
Content

Development of the DeCoM comes from the requirement of analyzing the performance of a condenser. A component of a loop heat pipe (LHP), the condenser, is interfaced with the radiator in order to reject heat. DeCoM simulates the condenser, with certain input parameters. Systems Improved Numerical Differencing Analyzer (SINDA), a thermal analysis software, calculates the adjoining component temperatures, based on the DeCoM parameters and interface temperatures to the radiator. Application of DeCoM is (at the time of this reporting) restricted to small-scale analysis, without the need for in-depth LHP component integrations. To efficiently develop a model to simulate the LHP condenser, DeCoM was developed to meet this purpose with least complexity. DeCoM is a single-condenser, singlepass simulator for analyzing its behavior. The analysis is done based on the interactions between condenser fluid, the wall, and the interface between the wall and the radiator.

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Citation
"Deepak Condenser Model (DeCoM)," Mobility Engineering, July 1, 2013.
Additional Details
Publisher
Published
Jul 1, 2013
Product Code
TBMG-16852
Content Type
Magazine Article
Language
English