Cooling Lasers with Thin-Film Thermoelectric Coolers

Laser diodes for telecommunications have traditionally used thermoelectric coolers (TECs) for precision temperature control to improve diode output levels and maintain wavelength integrity. A major trend for photonics in telecommunications has been the move to more integrated packaging that is smaller and simpler in structure in order to lower costs. This, in turn, has opened the door for higher volume manufacturing. In the course of this transition, conventional TEC solutions have become increasingly difficult to implement as conventional bulk thermoelectric technology has not kept pace with the size and power density requirements for next generation devices.