Cooling Embedded Systems What Are The Options?

As the cooling challenges in embedded system applications have multiplied due to increased processing performance, smaller package and system footprints, and the requirement to operate in more rugged environments, new thermal management options and industry standards continue to evolve. Designers of systems for these markets, and especially those in remote or rugged, 24/7 operating environments, have always had to make difficult decisions regarding lifespan, reliability, and cost.