Cooling Your Embedded System

What Can Your Open Standard Architecture Handle?

Embedded computing systems for Mil/Aero applications are often conduction-cooled in an ATR or nonstandard chassis. However, there are many designs that require 19″ rackmount systems with forced-air cooling. As more processing performance is packed into tight spaces, enclosures that provide advanced cooling options are increasingly common.

The open-standard embedded architectures have different recommended limitations for power. Sometimes these are electrical pinout limitations, and other times they are recommended thermal limitations. There are “tricks of the trade” to extend the power for certain architectures as well as the ability to maximize the thermal limits.