Magazine Article

Computer Code for Analysis of Stress in Silicon Wafers

TBMG-32062

12/01/1998

Abstract
Content

The MacWafer™ code computes gravitational and thermal stresses in silicon wafers and uses these results to determine the maximum allowable temperature variation across a wafer, maximum processing temperatures, and maximum allowable heating and cooling rates. This information is of particular interest in the case of processing 300-mm wafers coupled with fast ramp technologies. The program runs interactively on Apple Macintosh, IBM PC, and PC clones, and workstation computers as well. Execution time is typically about 20 seconds on a Motorola 68040 processor operating at 33 MHz.

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Citation
"Computer Code for Analysis of Stress in Silicon Wafers," Mobility Engineering, December 1, 1998.
Additional Details
Publisher
Published
Dec 1, 1998
Product Code
TBMG-32062
Content Type
Magazine Article
Language
English