Composite-Material Heat Sink for Printed-Circuit Boards

A laminated composite-material plate has been developed for use as a lightweight heat sink and mechanical support for rigid printed-circuit boards (PCBs) that hold surface-mounted electronic components. This composite-material plate is intended to replace a conventional aluminum heat-sink plate. The aluminum plate weighs 0.63 lb (0.29 kg), whereas the composite-material plate weighs only 0.36 lb (0.16 kg).