Magazine Article

Capacitively Coupled Plasma Analysis

TBMG-8419

09/01/2010

Abstract
Content

Plasmas consist of electrons, ions, and neutral species interacting with each other and with externally imposed electromagnetic fields. Plasma etching and deposition of thin films are critical processes in the manufacture of advanced microelectronic devices. These processes commonly utilize a capacitively coupled plasma (CCP), in which the plasma is initiated and sustained by an oscillating electric field in a region between two or more electrodes. While CCPs are typically generated at frequencies in the 10-100 MHz range, some applications benefit from operation at lower frequencies. In this regime, free electrons are generated both by collisions between electrons and atoms or molecules, and by secondary electron emission caused by ion bombardment of the electrodes.

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Citation
"Capacitively Coupled Plasma Analysis," Mobility Engineering, September 1, 2010.
Additional Details
Publisher
Published
Sep 1, 2010
Product Code
TBMG-8419
Content Type
Magazine Article
Language
English