Broadband Via-Less Microwave Crossover Using Microstrip- CPW Transitions

TBMG-11872

11/01/2011

Abstract
Content

The front-to-back interface between microstrip and CPW (coplanar waveguide) typically requires complex fabrication or has high radiation loss. The microwave crossover typically requires a complex fabrication step. The prior art in microstrip-CPW transition requires a physical vias connection between the microstrip and CPW line on a separate layer. The via-less version of this transition was designed empirically and does not have a close form solution. The prior art of the micro wave crossover requires either additional substrate or wire bond as an air bridge to isolate two microwave lines at the crossing junction. The disadvantages are high radiation loss, no analytical solution to the problem, lengthy simulation time, and complex fabrication procedures to generate air bridges or via. The disadvantage of the prior crossover is a complex fabrication procedure, which also affects the device reliability and yield.

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Citation
"Broadband Via-Less Microwave Crossover Using Microstrip- CPW Transitions," Mobility Engineering, November 1, 2011.
Additional Details
Publisher
Published
Nov 1, 2011
Product Code
TBMG-11872
Content Type
Magazine Article
Language
English