Apparatus Measures Thermal Conductance Through a Thin Sample From Cryogenic to Room Temperature

An apparatus allows the measurement of the thermal conductance across a thin sample clamped between metal plates, including thermal boundary resistances. It allows in-situ variation of the clamping force from zero to 30 lb (133.4 N), and variation of the sample temperature between 40 and 300 K. It has a special design feature that minimizes the effect of thermal radiation on this measurement.