Alternative Packaging for Back-Illuminated Imagers

An alternative scheme has been conceived for packaging of silicon- based back-illuminated, back- side-thinned complementary metal oxide/semiconductor (CMOS) and charge-coupled-device image-detector integrated circuits, including an associated fabrication process. This scheme and process are complementary to those described in “Making a Back- Illuminated Imager With Back-Side Connections” (NPO-42839), NASA Tech Briefs, Vol. 32, No. 7 (July 2008), page 38.