Advanced Ultra-Thin Integrated Electronics on Membranes
TBMG-2420
11/01/2007
- Content
A method of fabricating flexible assemblies comprising flexible integrated circuits bonded onto or into flexible membranes has been developed. The method provides for bonding of thinned (more specifically, thin enough to be flexible) integrated-circuit chips to the membranes and for electrical connection of the integrated circuits to other circuitry on or in the membranes. The method is expected to enable the further development of a variety of membrane-based flexible, lightweight electronic systems and assemblies — for example, phasedarray antenna assemblies comprising integrated-circuit transmitting/ receiving (T/R) modules further integrated with arrays of transmission lines and antenna radiator elements.
- Citation
- "Advanced Ultra-Thin Integrated Electronics on Membranes," Mobility Engineering, November 1, 2007.