Magazine Article

Advanced Ultra-Thin Integrated Electronics on Membranes

TBMG-2420

11/01/2007

Abstract
Content

A method of fabricating flexible assemblies comprising flexible integrated circuits bonded onto or into flexible membranes has been developed. The method provides for bonding of thinned (more specifically, thin enough to be flexible) integrated-circuit chips to the membranes and for electrical connection of the integrated circuits to other circuitry on or in the membranes. The method is expected to enable the further development of a variety of membrane-based flexible, lightweight electronic systems and assemblies — for example, phasedarray antenna assemblies comprising integrated-circuit transmitting/ receiving (T/R) modules further integrated with arrays of transmission lines and antenna radiator elements.

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Citation
"Advanced Ultra-Thin Integrated Electronics on Membranes," Mobility Engineering, November 1, 2007.
Additional Details
Publisher
Published
Nov 1, 2007
Product Code
TBMG-2420
Content Type
Magazine Article
Language
English