Advanced silicones for ADAS in light vehicles
25AUTP03_02
03/01/2025
- Content
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Material solutions for thermal management, protection and assembly.
Today's ADAS designers are adding more electronic components and redundant computing systems to printed circuit boards (PCBs). These heat-generating electronic assemblies are installed in enclosures that provide environmental protection, but the high heat generated by high-performance computing systems can degrade ADAS performance or cause device failure.
Not all thermal management materials can withstand temperatures up to 200 C (392 F), and most do not retain their flexibility at elevated temperatures. This creates a problem when PCB components expand and contract at different rates due to mismatches in their coefficients of thermal expansion.
- Pages
- 5
- Citation
- Sootsman, J., and Zou, L., "Advanced silicones for ADAS in light vehicles," Mobility Engineering, March 1, 2025.