Advanced silicones for ADAS in light vehicles

25AUTP03_02

03/01/2025

Authors Abstract
Content

Material solutions for thermal management, protection and assembly.

Today's ADAS designers are adding more electronic components and redundant computing systems to printed circuit boards (PCBs). These heat-generating electronic assemblies are installed in enclosures that provide environmental protection, but the high heat generated by high-performance computing systems can degrade ADAS performance or cause device failure.

Not all thermal management materials can withstand temperatures up to 200 C (392 F), and most do not retain their flexibility at elevated temperatures. This creates a problem when PCB components expand and contract at different rates due to mismatches in their coefficients of thermal expansion.

Meta TagsDetails
Pages
5
Citation
Sootsman, J., and Zou, L., "Advanced silicones for ADAS in light vehicles," Mobility Engineering, March 1, 2025.
Additional Details
Publisher
Published
Mar 01
Product Code
25AUTP03_02
Content Type
Magazine Article
Language
English