Active Fiber Optic Microelectromechanical Systems Aligner

As currently practiced, packaging of individual optoelectronic components accounts for 40-50 percent of product cost. The development of higher-volume, lower-cost optoelectronic manufacturing technologies must take place in order to accelerate the installation of optoelectronics in lower-speed and shorter-distance networks, such as telecommunications, computer, and video applications for both defense and commercial systems.