Acceleration Resistant HiK Heat Spreader

As electronic technologies advance in defense and aerospace applications, heat fluxes are becoming larger and more centralized^[1,2]. In order to meet the performance specifications of new technologies, thermal solutions must also advance. The push for more capable thermal technologies is evident with the U.S. Air Force Research Laboratory (AFRL) signing an agreement with private companies and contractors for the development of innovative vapor cooling technologies capable of handling high heat fluxes^[2].

Basic aluminum spreaders are no longer a viable means of spreading the heat as increased heat fluxes result in large thermal gradients across aluminum alone. Embedding heat pipes, a passive two-phase thermal solution, into an aluminum or copper spreader could distribute the heat flux to areas where it could be easily removed without a large thermal gradient. This technology is referred to as a HiK™ plate.