A model instrument panel

ANSYS researchers implement simulation-driven product development for thermoforming of instrument panels.

Ever-increasing energy and resin prices are continually putting pressure on plastic part manufacturers. An incremental weight reduction of thermoformed parts may result in substantial cost savings, which can then be passed to the end consumer, providing a competitive edge. Weight reduction, however, should not come at the expense of the structural integrity of the part.

Thermoforming is gaining ground in the automotive industry, particularly for large specialty parts. Instrument panels (IPs) are one good example.