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The Process Origin of Impurities in Hermetic Electronic Device Packages

Published 1967-02-01 by SAE International in United States
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Package Fabrication and Evaluation

Published 1967-02-01 by SAE International in United States
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Reliability Control in Parallel Gap Welding

Published 1965-02-01 by SAE International in United States
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Weld Stress Evaluation — Electronic Modules

Published 1965-02-01 by SAE International in United States
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A New Approach to Parallel-Gap Joining

Published 1967-02-01 by SAE International in United States
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Inspection and Control Requirements for Hot Gas Soldered Flat Pack Connections

Published 1967-02-01 by SAE International in United States
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Microelectric Welding - An Approach to Improved Reliability

Published 1967-02-01 by SAE International in United States
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Thermal Stress Analysis of Epoxy Encapsulants

Published 1967-02-01 by SAE International in United States
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Packaging of Electronic Signal Conditioning Equipment for the Project Apollo Lunar Module

Published 1967-02-01 by SAE International in United States
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Packaging for Electromagnetic Compatibility

Published 1967-02-01 by SAE International in United States
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