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Inspection and Control Requirements for Hot Gas Soldered Flat Pack Connections
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English
Abstract
Acceptance of the flat pack as a standard configuration for integrated circuits has stimulated development of new interconnection techniques which necessitated development of new criteria and controls for these techniques. One method being utilized at Martin-Denver is a hot gas soldering process in which the solder joints are made by passing the printed circuit board containing the flat packs under hot gas jets. Specification of this process for a possible space application necessitated development of inspection criteria and controls to ensure the required joint reliability. This was accomplished concurrently with development of the soldering process and qualification method.
Authors
Citation
Kraut, A., "Inspection and Control Requirements for Hot Gas Soldered Flat Pack Connections," SAE Technical Paper 670215, 1967, https://doi.org/10.4271/670215.Also In
References
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