Verification of Discrete and Packaged Photonic Device Technology Readiness
- Aerospace Standard
- ARP6318
- Issued
Scope
Rationale
Topic
Data Sets - Support Documents
| Title | Description | Download |
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| Unnamed Dataset 1 | ||
| Unnamed Dataset 2 | ||
| Unnamed Dataset 3 | ||
| Table 1 | Laser chip-on-carrier testing | |
| Table 2 | Modulator chip-on-carrier level testing | |
| Table 3 | Photodiode chip-on-carrier level testing | |
| Table 4 | Photonic-packaged component design verification test methodology |
Issuing Committee
AS-3 Fiber Optics and Applied Photonics Committee
The SAE AS-3 Fiber Optics and Applied Photonics committee addresses all facets of fiber optics systems and applied photonics¿design, maintenance, and in-service experience. It provides definition and support, and assures standardized components and systems approaches for fiber optic data buses. This includes sensors, architecture, and requirements for advanced fiber and electro optic technologies. The group is comprised of four subcommittees dedicated to creating, preparing, and maintaining all relevant specifications, standards, and requirements for fiber optics and applied photonics systems. These subcommittees include:
AS-3A Fiber Optic Applications AS-3B Fiber Optic Supportability AS-3C Fiber Optic Components AS-3D Fiber Optic Process Definition Participants in the SAE AS-3 committee include OEMs, suppliers, aircraft fiber optics and applied photonics systems companies, consulting firms, government and others across the aerospace and defense industries.Reference
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