This content is not included in your SAE MOBILUS subscription, or you are not logged in.
POLYIMIDE PRINTED CIRCUIT BOARDS
- Aerospace Standard
Published October 01, 1979 by SAE International in United States
Downloadable datasets availableAnnotation ability available
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multi-layer boards.
Data Sets - Support Documents
|[Unnamed Dataset 1]|
|[Unnamed Dataset 2]|
|[Unnamed Dataset 3]|
|[Unnamed Dataset 4]|
|[Unnamed Dataset 5]|
|[Unnamed Dataset 6]|
|[Unnamed Dataset 7]|
|[Unnamed Dataset 8]|
Welcome to the AMS-P Polymeric & Composites Materials Committee discussion forum.The AMS-P Polymeric Materials Committee writes and revises Aerospace Material Specifications (AMS), Metric Aerospace Materials Specifications (MAM), Aerospace Recommended Practices (ARP), and Aerospace Information Reports (AIR) for composite material technology as assigned to the committee. No copyrighted material may be posted in this forum. SAE is not liable for opinions expressed or information posted to this forum. All information posted becomes the property of SAE.
* Redlines comparisons are available for those standards listed in the Revision History that contain a radio button. A redline comparison of the current version against a revision is accomplished by selecting the radio button next to the standard and then selecting 'compare'. At this time, Redline versions only exist for some AMS standards. SAE will continue to add redline versioning with ongoing updates to SAE MOBILUS.