AMS3736: POTTING COMPOUND, EPOXY, FILLED 25 – 30 CTE, 175 HDT Room Temperature Cure - Material Specification

Features

Issuing Committee: AMS P Polymeric Materials Committee

Scope

Content: No Scope available

Meta Tags

Topics: Polymers
Suppliers
Materials properties
Manufacturing processes
Manufacturing systems
Production
Resins
Thermoplastics
Insulation
Fabrication
Metals

Details

DOI: https://doi.org/10.4271/AMS3736

Pages: 2

Citation: SAE International Material Specification, POTTING COMPOUND, EPOXY, FILLED 25 – 30 CTE, 175 HDT Room Temperature Cure, SAE Standard AMS3736, Issued August 1958, https://doi.org/10.4271/AMS3736.

Additional Details

Publisher: SAE International

Published: Jun 1, 1996

Product Code: AMS3736

Content Type: Material Specification

Status: Issued

Language: English

Historical