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RESIN, POLYIMIDE, LAMINATING High Temperature Resistant, 315°C (600°F)
- Aerospace Material Specification
Published October 01, 1979 by SAE International in United States
Downloadable datasets availableAnnotation ability available
This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure.
Data Sets - Support Documents
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