Fabricating Superconducting Circuitry on Both Sides of an Ultrathin Silicon Layer

  • Magazine Article
  • TBMG-40778
Published February 01, 2022 by Tech Briefs Media Group in United States
Language:
  • English

A new fabrication methodology addresses the need for a thin, double-sided circuitry board capable of low crosstalk between sensors and low loss in transmission lines.