How Miniaturized Distributed Modular Architecture Advances Avionics Design

  • Magazine Article
  • TBMG-34865
Published 2019-08-01by Tech Briefs Media Group in United States
Language:
  • English

Most of today’s collision-avoidance, in-flight-entertainment (IFE), air-to-ground-communications, and other avionics systems employ electronics packaging based on the Aeronautics Radio INC (ARINC) 600 standard. Compared to the older ARINC 404 standard dating from the 1970s that defined “black box” enclosures and racks within aircraft, ARINC 600 specified a Modular Concept Unit (MCU) – the basic building block module for avionics. An ARINC 600 metal enclosure can hold up to 12 MCUs, allowing a lot of computing power to be placed in a centralized “box.” By making it possible to run numerous applications over a real-time network, ARINC 600 enabled “next generation” integrated modular avionics (IMA).