Material Brings Optical Communication onto Silicon Chips

TBMG-32498

08/01/2018

Abstract
Content

An increase in computing performance has been achieved by squeezing ever more transistors into a tighter space on microchips. This downsizing has also meant packing the wiring within microprocessors ever more tightly together, leading to effects such as signal leakage between components, which can slow down communication between different parts of the chip. This delay, known as the “interconnect bottleneck,” is becoming an increasing problem in high-speed computing systems.

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Citation
"Material Brings Optical Communication onto Silicon Chips," Mobility Engineering, August 1, 2018.
Additional Details
Publisher
Published
Aug 1, 2018
Product Code
TBMG-32498
Content Type
Magazine Article
Language
English