SSB1_002: Environmental Tests and Associated Failure Mechanisms - Information Report

Features

Issuing Committee: CE-12 Solid State Devices

Scope

Content: This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.

This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

Meta Tags

Topics: Joining
Failure modes and effects analysis (FMEA)
Humidity
Environmental testing
Pressure
Physical examination
Integrated circuits
Logistics
Packaging

Details

DOI: https://doi.org/10.4271/SSB1_002

Pages: 13

Citation: SAE International Information Report, Environmental Tests and Associated Failure Mechanisms, SAE Standard SSB1_002, Stabilized September 2014, Issued October 1999, https://doi.org/10.4271/SSB1_002.

Additional Details

Publisher: SAE International

Published: Sep 12, 2014

Product Code: SSB1_002

Content Type: Information Report

Status: Stabilized

Language: English