SSB1D Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications

Revised

01/14/2020

Features
Issuing Committee
Scope
Content
This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, space, extreme, or other environments.
Rationale
Content
This document is intended to provide guidance for Using Plastic Encapsulated Microcircuits and Semiconductors (PEMs) in Military, Aerospace, and other rugged applications. This document addesses the various qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in military and aerospace applications. The users can use this document to evaluate the potential suitability of a PEM product or the manufacturer for its intended application. SSB-1 Rev D has been updated from SSB-1 Rev C to take into account the comments from various CE-12 members. The changes from SSB-1 Rev C to SSB-1 Rev D are shown in Appendix A: (informative) Differences between SSB-1 Rev C and SSB-1 Rev D.
Meta TagsDetails
DOI
https://doi.org/10.4271/SSB1D
Pages
19
Citation
SAE International Information Report, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications, SAE Standard SSB1D, Revised January 2020, https://doi.org/10.4271/SSB1D.
Additional Details
Publisher
Published
Jan 14, 2020
Product Code
SSB1D
Content Type
Information Report
Status
Revised
Language
English

Revisions