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Software/Hardware Systems, Systems Engineering, Advanced Electronics Packaging, and Electromagnetic Compatibility (Emc)

  • Special Publication
  • SP-1857
Published March 08, 2004 by SAE International in United States
Software/Hardware Systems, Systems Engineering, Advanced Electronics Packaging, and Electromagnetic Compatibility (Emc)
Sector:
Language:
  • English
Pages:
  • 230 pages
This SAE Special Publication presents papers from the sessions Software/Hardware Systems, Systems Engineering, Advanced Automotive Electronics Packaging, and Electromagnetic Compatibility (EMC).