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Microelectronics Failure Analysis, Sixth Ed.

  • Book
  • B-ASM-035
Published October 01, 2011 by ASM International in United States
Microelectronics Failure Analysis, Sixth Ed.
  • English
  • 660 pages

This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. Topics include: • Failure Analysis Process Flow • Failure Verification • Failure Modes and Failure Classification • Special Devices (MEMS, Optoelectronics, Passives) • Fault Localization Techniques: Package Level (NDT) • Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods) • Deprocessing & Imaging Techniques: Deprocessing • General Imaging Techniques • Local Deprocessing & Imaging • Circuit Edit and Design Modification • Material Analysis Techniques • Reference Information: Important Topics for Semiconductor Devices • Failure Analysis Techniques Roadmap • Failure Analysis Operations and Management • Appendices: Failure Analysis Terms, Definitions, and Acronyms • Industry Standards