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Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications
- Aerospace Standard
Published April 24, 2018 by SAE International in United States
Downloadable datasets availableAnnotation ability available
This SAE Aerospace Standard (AS) documents and establishes common industry practices, and screening and qualification testing, of Plastic Encapsulated Microcircuits (PEMs) for use in military and avionics application environments.
This document provides requirements for screening and qualification for use of plastic encapsulated microcircuits (PEMs) in military and avionics applications. The level of testing on PEMs depends on the application and reliability requirements of the system allocated to the PEMs. It is the responsibility of the user to assure compliance with the requirements specified herein, or to assure that any tailoring of requirements meets the end application requirements. This document addresses many of the concerns associated with PEM construction and manufacturing, primarily the non-hermetic packaging and the supply chain situation of multiple material sets and assembly sites.
The approach to establishing PEM reliability defined herein leverages several existing industry standards, including AEC Q100, JESD47, MSFC-STD-3012, and SAE SSB-1.
|Aerospace Standard||Requirements for Plastic Encapsulated Microcircuits in Space Applications|
|Aerospace Standard||Requirements for Plastic Encapsulated Discrete Semiconductors in Space Applications|
Data Sets - Support Documents
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|Table 1||PEM grade description|
|Table 2||Qualification for PEMs|
|Table 3||Qualification for PEMs|
The CE-12 Solid State Devices Committee develops solutions to technical problems in the application, standardization, and reliability of solid state devices. This is implemented by evaluation and preparation of recommendations for specifications, standards, and other documents, both government and industry, to assure that solid state devices are suitable for their intended purposes.
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