This content is not included in
your SAE MOBILUS subscription, or you are not logged in.
Risk Mitigation for Pb-Free Solders Used Internally to Parts
- Aerospace Standard
- ARP6537
- Issued
Downloadable datasets available
Annotation ability available
Sector:
Issuing Committee:
Language:
English
Scope
This document provides risk mitigation for Pb-free solders used internal to parts used in Aerospace and Defense applications. It will include mitigations applicable to encapsulated and cavity devices as the needs arise in industry. Currently this revision only addresses devices with encapsulation or underfill. Mitigations for open cavity devices are still being discussed, and will be addressed in future revisions.
Microbumps with Thermal Compression Bonding (TCB) are not addressed by the mitigations in this document. The use of Pb-free microbumps with TCB are considered out of scope at this time.
It is expected that this document will be primarily used by Control Levels 3 and 2C (as defined in GEIA-STD-0005-2 for programs that do not allow use of Pb-free tin or only allow its use on an exception basis). It may be used by other levels, or by applications not using GEIA-STD-0005-2.
Rationale
Piece part suppliers have been transitioning to using Pb-free solders within parts. However, aerospace and military programs are concerned about the risk from tin whiskers and the durability of these materials in their applications due to their special circumstances (see Introduction). This document will provide guidance on necessary tests and evaluations for parts using Pb-free solders to mitigate these risk concerns.
Recommended Content
Aerospace Standard | Verification of Discrete and Packaged Photonic Device Technology Readiness |
Aerospace Standard | Manufacturers’ Identification of Aerospace Electrical and Electronic Wiring Devices and Accessories |
Aerospace Standard | Validation Methods for MIL-STD-1760 Mission Stores |
Topic
Data Sets - Support Documents
Title | Description | Download |
---|---|---|
Unnamed Dataset 1 | ||
Unnamed Dataset 2 | ||
Table 1 | Part group definitions | |
Table 2 | Qualification (or PIDTP) requirements | |
Table 3 | Lot screening requirements for space applications |
Issuing Committee
G-24 Pb-free Risk Management Committee for ADHP
Pb-free Risk Management Committee for ADHP Committee develops standards and specifications for Pb-free electronics risk management for the aerospace, defense and high performance electronics industries. The committee also provides input to government and other industry standards related to Pb-free electronics risk management. It does not develop or revise workmanship and manufacturing standards.
Reference
Number | Title |
---|
* Redlines comparisons are available for those standards
listed in the Revision History that contain a radio button. A
redline comparison of the current version against a revision is
accomplished by selecting the radio button next to the standard and
then selecting 'compare'. At this time, Redline versions only exist
for some AMS standards. SAE will continue to add redline versioning
with ongoing updates to SAE MOBILUS.