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Potting Compound, Epoxy Bisphenol A-Type
- Aerospace Material Specification
Published September 22, 2016 by SAE International in United States
This specification and its supplementary detail specifications cover epoxy resin formulations based on diglycidyl ether of bisphenol A with an epoxide equivalent of 175-195. When properly mixed and cured, these resisns produce a rigid or flexible product.
Cancel due to inaccurate technical requirements.
|Aerospace Material Specification||Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure|
|Aerospace Material Specification||Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant|
|Aerospace Material Specification||Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Machinable|
Data Sets - Support Documents
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